limitations of hdi pcbs
PCBs play a critical role in the manufacturing of electronic devices like laptops, phones and tablets. As technology advances, manufacturers have to develop smaller and denser PCBs to ensure they can meet the growing demand for these gadgets. This development has led to the introduction of HDI (high-density interconnect) PCBs, which allow designers to fix multiple components on a small-sized board, with full functionality.
Using HDI PCBs makes it possible for manufacturers to produce electronic products that are lighter and compact, which has become a necessity in today’s market. However, the intricate processes involved in etching and fabricating HDI circuit boards can also contribute to elevated production costs. This cost factor makes it important for designers to carefully weigh the advantages of HDI PCBs against their associated production expenses when making design decisions.
One of the main limitations of hdi pcbs is that they cannot handle high-speed signals. This is because the distance between the traces on an HDI board is much smaller, which causes signal interference. To overcome this limitation, engineers can use shielding to isolate the traces from each other and improve performance. However, this technique can be expensive, which limits its adoption in price-sensitive markets.
What are the limitations of hdi pcbs?
Another limit of hdi pcbs includes the fact that they are more difficult to route compared to standard PCBs. This is mainly because of the lack of standard via sizes and shapes, as well as the increased number of layers. The higher layer count and complexity also increases the manufacturing time, which can limit the adoption of this technology in price-sensitive markets.
Finally, a limitation of hdi pcbs may be the difficulty in placing BGAs on them. This is because of the increased height of the chip and the resulting reflow temperature. To avoid this problem, it is essential to use a good fanout strategy when designing your HDI circuit board.
When choosing an HDI PCB, it is important to consider the type of vias you need. This will determine the trace width, hole size and backup dimension you need. Additionally, it will influence the routing density you can achieve. To increase the routing density, you can choose to stack vias, but this will increase the number of sequential laminations and make your PCB more costly.
To reduce the number of sequential laminations, it is best to choose a design that uses fewer sequential layers. In addition, you should select the right type of prepreg for your circuit board. This will help to reduce the manufacturing costs while maintaining quality and reliability.
Once your PCB has been designed and passed a DFM review, it is time to prepare the fabrication files and assembly drawings for the fabricator and assembler. Using the unified design environment in Altium Designer, you can quickly and easily generate Gerbers/ODB++/IPC-2581 fabrication files, drill tables, a bill of materials and assembly drawings for your new HDI PCB. Be sure to take into account the manufacturer’s fabrication guidelines and constraints, including core materials, prepreg thicknesses, and the placement of silkscreen and reference designators.
